• 6 Posts
  • 291 Comments
Joined 1 year ago
cake
Cake day: August 15th, 2023

help-circle
  • All good! It’s the same situation as I described and I see that increasing temps did help. It’s good to do a temperature tower test for quality and also a full speed test after that. After temperature calibration, print a square that is only 2 or 3 bottom layers that covers the entire bed at full speed or faster. (It’s essentially a combined adhesion/leveling/extrusion volume/z offset test, but you need to understand what you are looking at to see the issues separately.)

    If you have extrusion problems, the layer line will start strong from the corners, get thin during the acceleration and may thicken up again at the bottom of the deceleration curve. A tiny bit of line width variation is normal, but full line separation needs attention.

    Just be aware if you get caught in a loop of needing to keep bumping up temperatures as that starts to get into thermistor, heating element or even some mechanical issues/problems.


  • I am curious as to why they would offload any AI tasks to another chip? I just did a super quick search for upscaling models on GitHub (https://github.com/marcan/cl-waifu2x/tree/master/models) and they are tiny as far as AI models go.

    Its the rendering bit that takes all the complex maths, and if that is reduced, that would leave plenty of room for running a baby AI. Granted, the method I linked to was only doing 29k pixels per second, but they said they weren’t GPU optimized. (FSR4 is going to be fully GPU optimized, I am sure of it.)

    If the rendered image is only 85% of a 4k image, that’s ~1.2 million pixels that need to be computed and it still seems plausible to keep everything on the GPU.

    With all of that blurted out, is FSR4 AI going to be offloaded to something else? It seems like there would be a significant technical challenges in creating another data bus that would also have to sync with memory and the GPU for offloading AI compute at speeds that didn’t risk create additional lag. (I am just hypothesizing, btw.)


  • 185C is cold for PLA. It may work for slow prints, but my personal minimum has always been around 200C and my normal print temperature is usually at 215C.

    Long extrusions are probably sucking out all the heat from the nozzle and it’s temporarily jamming until the filament can heat up again.

    Think of the hotend as a reservoir for heat. For long extrusions, it will drain really fast. Once the hotend isn’t printing for a quick second, it will fill back up really fast. At 185C, you are trying to print without a heat reservoir. I mean, it’ll work, but not during intense or extended extrusions.


















  • Yeah. Modern phones are awesome if you need to use every feature to its fullest. I love that I have the opinions to access my accelerometer or GPS independently. Since I do a bit of CAD work, having a high quality camera is awesome for photogrammetry. But see, there is a caveat: It’s the right tool for me and worth my $1K to have an up-to-date device that has a reasonable bit of compute.

    Otherwise, nah. I just got a resin 3D printer that only has a USB connector. No cloud, no wifi, no bullshit. It does its one job well and that is all I care about.

    It sucks that most people are basically trained from birth that “more is better” or “brand new is better”. It took me years to de-program myself from that shit.